Orifice plate design in Shenzhen PCB processing

Orifice plate design in Shenzhen PCB processing

Perforated disk design, including the design of various types of disks with metalized holes and non-metalized holes, these designs are related to the processing capacity of the PCB.

The expansion and contraction of film and material during PCB production, the expansion and contraction of different materials during pressing, the position accuracy of pattern transfer and drilling, etc. will cause inaccurate alignment between the patterns of each layer. In order to ensure the good interconnection of the patterns of each layer, the width of the pad ring must consider the requirements of the pattern alignment tolerance between the layers, the effective insulation gap and the reliability. Reflected in the design is to control the pad ring width.

(1) The metalized hole pad should be greater than or equal to 5mil.

(2) The width of the insulation ring is generally 10mil.

(3) The width of the anti-pad ring on the outer layer of the metallized hole should be greater than or equal to 6mil, which is mainly proposed in consideration of the needs of solder mask.

(4) The width of the anti-pad ring in the inner layer of the metallized hole should be greater than or equal to 8mil, which mainly considers the requirements of the insulation gap.

(5) The anti-pad ring width of non-metallized holes is generally designed as 12mil.