PCBA scheme development and design

PCBA scheme development and designSoft hard combination boardThe birth and development of FPC and PCB have given rise to the new product of soft hard bonding boards. Therefore, the combination of soft

  • Model: PCBA scheme development and design

PCBA scheme development and design


PCBA scheme development and design


Soft hard combination board










The birth and development of FPC and PCB have given rise to the new product of soft hard bonding boards. Therefore, the combination of soft and hard circuit boards refers to the combination of flexible circuit boards and hard circuit boards through pressing and other processes, according to relevant process requirements, to form a circuit board with FPC and PCB characteristics.




The concept of a circuit board with FPC and PCB characteristics, known as a combination of software and hardware in Chinese, has the advantages of saving internal space in the product. However, it is difficult to produce and has a low yield rate




catalogue




What is a combination of soft and hard boards




2 Production process




3 Advantages and Disadvantages




4 Related application fields




The basic process flow of 5 soft hard combination boards




What is a combination of soft and hard boards? Editing




The birth and development of FPC and PCB have given rise to the new product of soft hard bonding boards. Therefore, the combination of soft and hard circuit boards refers to the combination of flexible circuit boards and hard circuit boards through pressing and other processes, according to relevant process requirements, to form a circuit board with FPC and PCB characteristics.




Production process editing




Because the combination of soft and hard boards is a combination of FPC and PCB, the production of soft and hard boards should have both FPC production equipment and PCB production equipment. Firstly, the electronic engineer draws the circuit and shape of the soft and hard bonding board according to the requirements, and then issues it to the factory that can produce the soft and hard bonding board. After processing and planning the relevant documents by the CAM engineer, the FPC production line is arranged to produce the required FPC and PCB production lines. After these two types of soft and hard boards are produced, according to the planning requirements of the electronic engineer, the FPC and PCB are seamlessly pressed together by a pressing machine. After a series of detailed steps, the soft and hard bonding board is finally produced. A very important aspect is that the combination of soft and hard boards is difficult and has many details. Before shipment, a full inspection is generally required because of its high value, in order to avoid causing losses to both supply and demand parties.




Advantages and disadvantages editing




Advantages: The combination of soft and hard boards has both the characteristics of FPC and PCB, so it can be used in some products with special requirements. It has a certain flexible area and a certain rigid area, which is very helpful for saving internal space, reducing finished product volume, and improving product performance.




Disadvantages: The production process of soft and hard combination boards is complex, with high production difficulty, low yield rate, and requires a lot of materials and manpower. Therefore, their prices are relatively expensive and the production cycle is relatively long.




Editing of related application fields




The characteristics of the soft hard combination board determine its application scope to cover all application areas of FPC and PCB, such as:




mobile telephone




Button board and side buttons, etc




Computers and LCD screens




Motherboard and display screen, etc




CD Walkman




Disk drive




NOTEBOOK




Latest uses




The components of the mounting circuit (Su ensi. N circuit) and xe packaging board of a hard disk drive (HDD).




Basic Process Flow Editing of Soft Hard Combination Board




1. Material selection [1]




2. Control of production process flow and key parts




2.1 Production process flow




2.2 Graph transfer of inner layer single chip




2.3 Multilayer positioning of flexible materials




2.4 Lamination




2.5 Drilling




2.6 Remove drilling and erosion




2.7 Chemical Copper Plating and Electroplated Copper




2.8 Surface resistance welding and weldability protection layer




2.9 Appearance processing [2]