Manufacturing capacity:PCB ItemCapability1.Base MaterialFR-1/FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC FPC2.Layers1-28
Manufacturing capacity:
PCB
Item | Capability | |
1.Base Material | FR-1/FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC FPC | |
2.Layers | 1-28 | |
3.Finised inner/outer copper thickness | 1-6OZ | |
4.Finished board thickness | 0.2-7.0mm | |
Tolerance | Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% | |
5.Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm | |
6.Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil | |
7.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm | |
Drilling precision: first drilling | First drilling: 1mil Second drilling: 4mil | |
8.Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% | |
9.Controlled Impedance | +/-5% | |
10. Aspect Ratio | 15:1 | |
11.Min welding ring | 4mil | |
12.Min solder mask bridge | ≥0.08mm | |
13.Plugging vias capability | 0.2-0.8mm | |
14. Hole tolerance | PTH: +/-3mil NPTH: +/-2mil | |
15.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole | |
16.Surface treatment | OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ | |
17.Solder mask | Green,Black,White,Blue,Red,Yellow,etc. | |
18.Silkscreen | Black,White,Blue,Red,Yellow,etc. | |
19. E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) | |
FQC-Physical Lab: Reliability tests | ||
20.Certificate | UL,SGS,ROHS,ISO/TS16949,ISO14001:2004 | |
PCB ASSEMBLY
| Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
| Type of Assembly | SMT,Thru-hole |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
| Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
| File Formate | Bill of Materials Gerber files Pick-N-Place file |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test,X-ray Inspection AOI Test |
