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Cheap price fast delivery alumina ceramic substrate printed circuit board assembly manufacturing

Cheap price fast delivery alumina ceramic substrate printed circuit board assembly manufacturing

NOItemProcess capability1product typeFR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB2Max layer count20 layers3Min base copper thickness1/3 OZ (12um)4Max finished coppe

  • Model： Cheap price fast delivery alumina ceramic substrate printed circuit board assembly manufacturing
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NO
Item
Process capability
1
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
2
Max layer count
20 layers
3
Min base copper thickness
1/3 OZ (12um)
4
Max finished copper thickness
10 OZ (350um)
5
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
6
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
7
Min spacing between hole to inner layer conductor
6mil (0.15mm)
8
Min spacing between hole to outer layer conductor
6mil (0.15mm)
9
Min annular ring for via
4mil (0.1mm)
10
Min annular ring for component hole
4mil (0.1mm)
11
Min BGA diameter
4mil (0.1mm)
12
Min BGA pitch
4mil (0.1mm)
13
Min hole size
0.15mm(CNC); 0.1mm(Laser)
14
Max aspect ratios
8.01
15
Min soldermask bridge width
4mil (0.1mm)
16
Soldermask/circuit processing method
Film
17
Min thickness for insulating layer
1mil (0.025mm)
18
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
19
Surface treatment type
ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
plating
20
Max PCB size
Multi-layer: 600*550mm 1-2 layer: 500*1200MM